B - 320 RF chip Bonder

B-320 RFID Die Bonding Machine

Product introduction :

B-320 RFID Die bonding machine confirms the process technology of

Lable before mass production. Compared with the traditional machine, it has greatly

improved in the counterpoint of chip and antenna, accuracy of temperature control,

the testable of heat pressing pressure value and heat pressing pressure time, enable

customers find the feasible process parameters , according to the characteristics of

their own antennas and chips, and finally improve product quality. The FCB-320

machine simplifies the operation, it not only guarantees the mass production, but

also guarantee the quality of small-quantity production to win trust from customers.

Feature :

1.Both vision system, one for die, another for antenna;

2.Both display, independent working, imagine suitable;

3.Independent heat pressure system, change easily and high accuracy;

4.Adopt PLC + temperature module + tough screen, steady temperature control;

5. Die dimension can exceed 2mm;

6.Operation easily, maintain easily;

7.Suitable RFID electronic tags product technology test, making sample, and small-quantity

production;

Technical parameters:

Operation Step:

1. Look for Die (move tray plate, use upper camera looking for die, make the cross on

the centre of die)

2. Pick up die (move the collet to the top of die, press the collet, then press the vacuum button

by hand, pick up die)

3. Adjust die (move away tray plate, use below camera adjusting die’s angle and XY

position, make the cross on the centre of die)

4. Put and adjust antenna (move the bondhead, use upper camera looking antenna, then adjust

the antenna’s angle and XY position, make the cross on the centre of antenna putting die

5. Dispense (move the dispensing tip to the top of the antenna, press the dispensing button by

hand, dispense automatic)

6. Die bonding (move the collet to the top of antenna, press the collet, then press the vacuum

button by hand, die bonding finished)

7. Heat pressure (Take the antenna to the heat pressure platform, put on the correct position,

push into and press the heat pressure button, the heat pressure finish automatic)

8. Repeat the upper process

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